„Heat dissipation“ describes the application onto substrates of filled, thermally conductive dispensing media in dots or beads. They are placed between the heat generating electronic component and the heat dissipating housing or heat sink.


Thermally conductive pastes are used for electronic components which generate much heat. The dispensing material has special properties which help to channel the heat generated by the assembly into a heat sink (e.g. a housing with a large surface area).
The dispensing media used are the so-called high-viscosity thermally conductive pastes or adhesives based on polyurethane, silicone or epoxy. They often contain hard filler materials with jagged edges, which make them highly abrasive when used.


The goal is to effectively dissipate the heat from the electronic component in order to avoid its overheating.



Damming and Sealing



Vacuum Bonding